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Resin Bond HTC Diamond Polishing Pads



Resin Bond HTC Diamond Pads for EZ Change Grinding Head

5 Dots Type

Designed specifically for Concrete floor restoration professional, HTC's resin-bond diamond Grinding Pads are many times used after the use of metal-bond diamond tools for floor polishing. However, in some cases a resin-bond diamond tool can be used as a starting tool on smooth flat floors.

Code No.: CD-DPP-F-C03
Segment Height: 10mm
Segment No.: 5pcs
Bond Type: Resin
Grit No.: 50#, 100#, 200#, 400#, 800#, 1500#, 3000#
Base Specification: Standard for HTC grinding head

China Diamant Tools Co., Limited
Tel: +86-595-22595473, Fax: +86-595-22595478, Mobile: +86-13959890092
Website: http://www.chinadiamant.com/, E-mail: info@chinadiamant.com, zzstone@163.net

« China(QingDao) International Stone Products & Machinery ExhibitionMetal Bond HTC Diamond Pad for EZ Change Grinding Head »
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